Monday, February 21, 2005

Etch Silicon with Plasmatherm 720

  1. Pressure = 100 mTorr (?), SF6 100 = 65 sccm, CCl2F2 = 15 sccm, Power = 100 W
  2. Rate = 2.5 mm/ 10 min; (5 min for about 1 micron)

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